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| Sigma Launches Windeo Ultra-Wideband Chipset Sigma Designs has announced their Windeo Ultra-Wideband (UWB) chipset. The Windeo Chipset, along with Sigma's media processors, offer the world's first total solution for high speed wireless A/V streaming aimed at replacing HDMI cable and other Audio/Video cabling for digital home entertainment equipment. While WiFi (802.11) solutions have largely satisfied the need for medium bandwidth data communications, the latest challenge is to address the needs of in-home audio/video entertainment connectivity with the right bandwidth and affordability to handle high-definition video streams. Ultra-Wideband (UWB) technology offers an ideal solution, supporting a maximum data rate of 480 Mbps with high QoS, low power consumption and mainstream consumer pricing. Sigma's Windeo all-CMOS chipset is comprised of two devices: the Windeo RF IC (B7CW101) and the Windeo Baseband IC (B7CW201) with an integrated PHY, MAC and embedded 32-bit RISC core - both of which are based on the WiMedia Alliance MAC & PHY specifications. The Windeo Chipset provides high performance wireless data rates using three bands, centered at 3.43 GHz, 3.96 GHz, and 4.48 GHz, with a spectrum spread of 528 MHz each. Sigma's patent-pending Intelligent Array Radio (IAR) technology extends coverage range while maximizing wireless link reliability and minimizing undesirable interference. IAR technology involves utilizing multiple receive radios to process multi-channel signals which are then subjected to adaptive algorithm that optimizes both amplitude and phase under various channel environments. Under the current implementation, the Windeo RF IC integrates 3 receive radios along with 1 transmit radio and the capability to support a 3-antenna array, establishing a high performance physical layer link. Then, the Windeo Baseband IC processes the 3 channels simultaneously and adaptively using the IAR algorithms on wide band signals. A major advantage of the IAR approach is to remain fully compatible with the WiMedia standard and relevant FCC requirements while enhancing basic performance. The Windeo RF IC is packaged in a small footprint 92-pin leadless Bump Chip Carrier (BCC) and supports data rates up to 480 Mbps. The Windeo Baseband is packaged in a 304-pin TFPGA. Besides the ability to support both WiMedia framing formats, DRP and PCA, the Windeo Baseband also supports several interfaces including PCI, mini-PCI, DVB-SPI and several local buses. The Windeo chipset interfaces are fully compatible with all Sigma's media processors including device driver and applications software. The Windeo chipset engineering samples and the Evaluation Kit with the EM8622L media processor are available now for ordering. Initial production availability is planned for December of this year. write your comments about the article :: © 2006 Networking News :: home page |