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| Sonics Announces New SMART Interconnect for Mid-Range SoCs Sonics announces the general availability of the SonicsLX SMART Interconnect solution that is targeted at mid-range complexity or value SoCs. SonicsLX contains advanced fabric features, such as a multithreaded non-blocking architecture and seamless universal connectivity to any AMBA AXI or AHB or OCP-IP cores. SonicsLX also contains a targeted set of data flow services, enabling a price-performance package better suited for mid-range SoC designs. The SonicsMX SMART Interconnect solution, the company's flagship product, contains a full set of advanced fabric features and data flow services, as dictated by the requirements of high-end or performance SoC designs. With over 100 million units shipped, Sonics SMART Interconnect solutions have been used in some of the world's leading-edge high-end SoCs, such as Texas Instruments' OMAP application processors for cell phones, HDTV chips developed by Samsung for LCD-based HDTVs, as well as office automation and automotive video processing applications. Market leaders have adopted SonicsMX to improve time-to-market, reduce design risks, and leverage a high degree of platform-based design flexibility. The addition of SonicsLX to the company's product line offers mid-range SoC developers similar benefits when using Sonics SMART Interconnect solutions. SonicsLX is targeted at markets, such as wireless base band and digital TV. It represents further support for the trend to outsource the interconnect of an SoC as complexities accelerate. write your comments about the article :: © 2006 Networking News :: home page |