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| Press-fit Pins for Solder-less Assembly of Power Modules Solder pins have been the interface of choice for power modules for many years. In this day and age, when cost saving very often leads to compromises in quality, Vincotech's new Press-fit technology goes against the trend. The new Press-fit pin takes the assembly properties of Vincotech power modules a step further: the solder-less assembly of the modules, equally easy on both sides of the PCB, leads to higher reliability and design flexibility. The aim of the development was an interconnect technology that would eliminate the need for soldering of the power module, whilst maintaining the reliability standards and electrical capabilities of the solder pin. A further the target was, to realize the exact same layouts as those of the solder modules. The Press-fit pin developed by Vincotech is reliable and electrically equal to the solder pin; this new press-in technology reduces assembly time and cost whilst increasing reliability. Added benefits are design flexibility, free choice of PCB thickness, and easy PCB repair and re-use. write your comments about the article :: © 2011 Computing News :: home page |