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| Hynix Announces Industry's First DDR3 Validations ![]() In addition to its high speed characteristics, DDR3 features reduced current consumption of almost 25%, compared to the present generation DDR2. Hynix's 'three-dimensional transistor' architecture minimizes current leakage to further reduce overall current consumption and ensure data integrity. DDR3 is the next generation DRAM interface which is expected to succeed the current mainstream DDR2 products. Demand for DDR3 is expected to emerge towards the end of the year. According to market research firm iSuppli, DDR3 will account for 25% of total DRAM shipments by the end of 2008 and dominate the market by 2010. Mass production of the 1Gb DDR3 on the 80nm line will begin in the third quarter of this year. Hynix plans to manufacture the product on the new 66nm process beginning in late 2007. write your comments about the article :: © 2007 Computing News :: home page |