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| Ansoft Releases ePhysics v2 Ansoft Corporation has announced the immediate availability of ePhysics v2. This latest version enhances ePhysics' 3D steady-state thermal, transient thermal and linear stress analyses coupling to HFSS and Maxwell 3D with dynamic-link co-simulation. The new capability allows engineers to simulate heating, stress and deformation consequences of high- and low-frequency electromagnetic fields. ePhysics v2 responds to the market demand to have an integrated, multi-disciplinary approach to electrical component design, essential for devices operating under high power, faster data rates and reduced physical size, where thermal and mechanical effects need to be evaluated due to their influence on the overall performance. The ePhysics user interface, including design management front-end, 3D modeler, parametric control, simulation set-up and post-processing interfaces, have been migrated to the Ansoft desktop concept shared by HFSS and Maxwell 3D. Engineers can easily account for the thermal and mechanical quantities that significantly contribute to a design's overall performance directly within the familiar, easy-to-use, Ansoft environment. Coupling ePhysics with Maxwell 3D provides the cross-disciplinary analysis required in the design of electromechanical devices. Typical applications include the analysis of electric machines, power-generation systems, transformers, microelectromechanical systems (MEMS) and solenoids. HFSS with ePhysics is vital for applications such as high-speed packages, antennas, monolithic microwave integrated circuits (MMICs), high-power microwave devices, military and broadcast communications and biological heating with radio frequency (RF) sources. These analyses include high-power, temperature-induced stress and size changes of design components. New features include: - New Ansoft desktop interface - Dynamic-link coupling with Maxwell 3D and HFSS, which includes automatic mapping of power loss and force densities integrated with adaptive meshing technology - Multiple design couplings that may be "daisy chained" in the process of creating complex applications - Maxwell Transient - Thermal Transient - HFSS Transient Sequence - Thermal Transient - Nonlinear thermal properties (conductivity vs. Temp) - Anisotropic stress solution - 64-bit solvers available ePhysics is available immediately for PC and UNIX platforms. write your comments about the article :: © 2006 Computing News :: home page |