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| Elpida's DIMMs Support Dual-Core Intel Xeon-Based Servers Elpida Memory has announced that they are supporting the launch of the new Dual-Core Intel Xeon-based server and workstation platforms (formerly codenamed "Bensley" and "Glidewell") with its high performance, high bandwidth 512 MB, 1 GB and 2 GB Fully Buffered Dual Inline Memory Modules (FB-DIMMs). Elpida's FB-DIMMs feature Elpida's state-of-the-art heat spreader design which helps to meet the stringent thermal and reliability requirements of the server platform. They offer data transfer rates of 667 Megabits per second (Mbps), which translates to peak throughput per channel of 8 Gigabytes per second. Elpida's FB-DIMMs are built using 512 Megabit and 1 Gigabit 90 nm DDR2 devices that are already in high volume production, and they complement Elpida's full line-up of DRAM devices and modules. FB-DIMM was created to address performance limitations associated with the previous standard for Registered DIMMs for server platforms. FB-DIMMs were designed to support next-generation processors and faster bus speeds. The FB-DIMM specification calls for all signals - clock, address, command and data - to and from the DRAM devices on the module to be buffered at the high-speed Advanced Memory Buffer (AMB) chip located on the DIMM. This helps to secure the DRAM timing margins during high-speed operation with a much shorter signal path between the DRAM and the AMB. The FB-DIMM also adopts a Point-to-Point connection on the bus between the memory controller and the DIMM, as well as between the DIMMs themselves. This allows increased bus speed with a shorter connection path. It also greatly improves the maximum number of DIMMs that can be loaded on the bus - up to eight 2-rank DIMMs per channel - with less concern about signal degradation. write your comments about the article :: © 2006 Computing News :: home page |