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| Intermold 2009/ Die & Mold Asia 2009  The Japan Die & Mold Industry Association is proud to announce INTERMOLD 2009 (IM2009, Date: April 8-11, 2009; Venue: TOKYO BIG SIGHT), the 20th Japan international Die & Mold Technology Exhibition, is the ideal business place for the people and the companies in the die & mold manufacturing field. INTERMOLD 2009 will be held in conjunction with Die & Mold Asia 2009 and Japan Metal Stamping Technology Exhibition 2009, thus assembling all processing technologies for die and mold in one comprehensive show."The Mold Grand Prix between Japan, China and South Korea" will be held on April 8 in celebration of the 20th anniversary. This Grand Prix is the first event at our show, and students at some universities in Japan, China and Korea compete with each other over their mold building skills. The special panel discussion will also be held on April 9. "Workshop" presentation seminars will be held every day by the exhibitors to introduce their latest products and technologies. As of February 3rd, the projected participation in INTERMOLD 2009/ Die & Mold Asia 2009/ Japan Metal Stamping Technology Exhibition 2009 is 257 exhibitors occupying 807 booths. The overseas association like CDMIA and KODMIC will bring and coordinate local exhibitors, and others from China, Korea, Taiwan, Singapore or Canada will continue to showcase their latest technologies. This annual event is eagerly expected by the people in the related industries, and they will visit the show to see and talk with you about future business opportunities. They are all ready for it. write your comments about the article :: © 2009 Exhibition News :: home page |