Intermold 2008-The 19th Japan Die & Mold Technology Exhibition

The Japan Die & Mold Industry Association and Television Osaka are proud to announce Intermold 2008 (IM2008, Date: April 17-20, 2008; Venue: INTEX Osaka), the 19th Japan international Die & Mold Technology Exhibition, is the ideal business place for the people and the companies in the die & mold manufacturing field. Intermold 2008 will be held in conjunction with Die & Mold Asia 2008 and Japan Metal Stamping Technology Exhibition 2008, thus assembling all processing technologies for die and mold in one comprehensive show.

As of February 15th, the projected participation in Intermold 2008/ Die & Mold Asia 2008/ Japan Metal Stamping Technology Exhibition 2008 is 330 exhibitors occupying 1, 171 booths. This would make it even larger in scale than the largest past show (326 exhibitors, 1, 111 booths in 2007)

Moreover this year, there will be a greater international presence than ever before, with about 50 exhibitors from around the world, especially from Asia. The China Pavilion will be making its first appearance, and others from Korea, Taiwan or Canada will continue to showcase their latest technologies.

On April 17, a free- admission keynote and special panel discussion will be held (Only in Japanese). The key note will be given by Mitsubishi Heavy Industries Executive Vice President Sunao Aoki. "Workshop" presentation seminars will be held every day by the exhibitors to introduce their latest products and technologies.

This annual event is eagerly expected by the people in the related industries, and they will visit the show to see and talk with you about future business opportunities. They are all ready for it. Don't you think you need to visit Intermold 2008?

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