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| DesignCon 2007 Exhibition The International Engineering Consortium (IEC) hosts a record-breaking number of exhibitors at DesignCon 2007, which takes place this January 29 through February 1 at the Santa Clara Convention Center in Santa Clara, CA. The DesignCon exhibition features leading organizations presenting EDA tools, test and measurement equipment, PCBs and related technologies, semiconductor components and IP, interconnect technologies and more. The DesignCon exhibition also features three Technology Pavilions this year providing attendees with hands-on demonstrations in specific technology areas including semiconductor and IP, PCB and verification. Also on the floor are the DesignCon Poster Sessions, which will be presented by industry authors during the Exhibition Floor Evening Reception on Tuesday and Wednesday. Poster topics include 3D-packaging technologies, advanced interconnect technologies, system-in-package (SiP) design and wafer-level testing. The TecPreview theatre takes the stage previewing some of the latest industry advancements using multimedia. Presenters include BERTScope, CA Design, eASIC, FuturePlus Systems, LeCroy Corporation, NEL Frequency Controls, Inc., Samtec, Synplicity, Inc. and Tektronix, Inc. The annual DesignTOUR also takes place at the show adding another exciting element. High-tech prizes fitting the theme of DesignCon will be given away to attendees from DesignCon sponsors such as Agilent Technologies, BERTScope, LeCroy Corporation, Molex, MOSAID Technologies, Rambus, Inc., Samtec and Tektronix, Inc. write your comments about the article :: © 2007 Exhibition News :: home page |