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| Jazz Semiconductor Announces Annual Technology Conference Jazz Semiconductor, an independent wafer foundry focused primarily on specialty CMOS process technologies, announced it will host its Annual Technology Conference on Friday, November 3, 2006. The one-day conference will provide an overview of Jazz Semiconductor's technology roadmap, business highlights and strategic initiatives as well as offer tours of the company's specialty manufacturing facility. Jazz is holding its Annual Technology Conference at its Newport Beach headquarters, following the 4th International System-on-Chip (SoC) Conference & Exhibit on November 1-2, also in Newport Beach. The Jazz Technology Conference will offer presentations on foundry market trends, Jazz new process offerings and the company's manufacturing operations. Jazz will also highlight its analog foundry model and its design kit and modeling features that enable advanced analog integration for next generation wireless, power management, high speed networking and data storage products. Jazz technology offerings include High Voltage CMOS, Bipolar-CMOS-DMOS (BCD), RFCMOS and SiGe BiCMOS processes for the manufacture of highly integrated analog systems-on-chip (SoCs), a concept often relegated to the digital realm, but now becoming more mainstream with the trends towards convergence in consumer and wireless products. Among Jazz Semiconductor's new process offerings to be highlighted at the conference are its 40V Bipolar-CMOS-DMOS (BCD) processes targeted for power management ICs and high performance amplifiers and drivers for consumer applications. Jazz will also provide an update on its leading 0.13-micron SiGe BiCMOS process, SBL13, which supports a low cost bipolar module for higher levels of digital integration coupled with analog and RF features for low cost wireless products. In addition, Jazz will showcase its manufacturing capability for MEMs devices and other high performance RF and Analog features. Jazz executives will also discuss the importance of accurate, comprehensive modeling in Analog and RF and how the company is bridging the design and manufacturing gap by pairing modular processes with modular design infrastructure. write your comments about the article :: © 2006 Exhibition News :: home page |