Optical Building Blocks Demonstrations

Opnext, Inc., the global leader in state-of-the-art laser technology, will demonstrate how its high-performance optical components are reducing costs and adding features such as increased thermal tolerance, tunability, and 10GbE transmission over legacy fiber at the 32nd European Conference and Exhibition on Optical Communication, ECOC 2006, in Cannes, France, September 25 - 27, 2006.

Opnext will feature the following demonstrations at the exhibition: The Opnext TRF5022, a high temperature XFP which enables higher port densities by increasing thermal tolerance. Recent innovations in InP DFB structures have enabled Opnext to produce higher junction temperature tolerant devices. The TRF5022 is a 10G multi-protocol XFP module capable of meeting all standards under a module case temperature of 85 degrees C. Having a module that can operate from -5 degrees C to 85 degrees C is an industry first. Enabling full migration to Small Form Factor Pluggables is the Opnext DWDM C-Band TRF79A6 2.7G direct modulation DFB for 120km applications and beyond. Opnext's unique approach enables less than 1W power dissipation, which reduces the thermal management requirements of system vendors. The Opnext solution also offers decision threshold tunability which enables receiver performance to be dynamically optimized.

Also at ECOC 2006, Opnext will showcase industry-leading, MSA compliant products and technology developments, which focus on four key areas of component design - lower cost, common footprint, higher quality and best in class performance. These products are based on Opnext's core optics, universal optical subassembly platform and augmented by Opnext's demonstrated expertise in building leading-edge 10G/bit devices and modules. All products being demonstrated will be RoHS compliant in keeping with Opnext's commitment to the environment.

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