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Master Bond introduces epoxy resin system

Master Bond Inc., Hackensack, N.J. has developed EP21LM-3, a two component, medium viscosity epoxy resin system for high performance bonding, encapsulation and coating. EP21LM-3 readily develops high physical strength properties including a tensile modulus greater than 100,000 psi (690 MPa) and a tensile shear strength greater than 2300 psi (16 MPa). It is easy to apply. Having a viscosity of 37,000 cps the product flows evenly and smoothly without application of pressure, wets surfaces and fills volumes quickly and completely.

The cured polymer has a Shore D hardness of 64. It features remarkable resistance to thermal cycling and many chemicals including water, oil, fuels and most organic solvents over the temperature range of -65°F to +250°F. Adhesion to metals, glass ceramics, wood, vulcanized rubbers and many plastics is excellent. The EP21LM-3 system is a superior electrical insulator with a dielectric strength over 350 V/mil and a volume resistivity of 1014 ohm-cm.



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