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New laser cutting machine from Bystronic

Bystronic introduces a laser cutting machine that is designed for modern material flow concepts with a simplified approach to operation that reduces the laser user's learning curve to just a few hours. ByVention is simple, compact, clever, reassuring and complete. With ByVention's straight-forward, logical operation, training time is reduced dramatically. The machine footprint is 20' x 20'. The control cabinet and the system's laser source are integrated into the machine frame to form a single unit. The cooling unit and the dust collector are also combined. With the system's integrated safety system, the operating area is completely accessible without the need for light curtains.

The ByVention is equipped with an innovative and clever material flow concept designed especially by Bystronic to make cut parts instantly available to the user. It also ensures flexibility when using various sizes of material and partially used sheets. Cut parts are continuously and automatically transported from the cutting area and are immediately available to the user even during the cutting process. The removal of parts is simple and convenient as the removal area is fully accessible. The cutting area is also easily reached from the front of the machine through a large sliding door. This new, patented processing concept makes a shuttle table unnecessary and can be used with various standard-sized metal sheet formats up to 5 x 10 ft.



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