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| New hi-temp thermally conductive epoxy from Aremco ![]() Aremco-Bond 860 is mixed in a ratio of 1 part resin to 1 part activator by weight and cures in 24 hours at room temperature or in 2 hours at 200°F. After curing, it exhibits a thermal conductivity of 8.5 Btu-in/hr-ft²-°F and dielectric strength of 250 volts/mil. The tensile shear strength is 1,375 psi. This system also demonstrates very good corrosion protection. Typical applications for Aremco-Bond tm 860 include the bonding of heat sinks and fins used in heat exchangers and electrical/electronic assemblies. Aremco-Bond tm 860 is supplied in pre-measured pint, quart, gallon and five gallon containers from stock. write your comments about the article :: © 2006 Construction News :: home page |