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Ikanos, Wintegra Ship Validated Ethernet Bonding Solution for VDSL2

Ikanos Communications and Wintegra announce an Ethernet bonding solution for their mutual VDSL2 customers. This solution combines Wintegra's Access Packet Processors and Ethernet in the First Mile bonding software with Ikanos' multi-mode VDSL2 central office chipsets. The jointly developed solution is designed to deliver a compelling mix of validated hardware and software, which enables carriers to rapidly deploy services.

A key benefit of Ethernet bonding at the line-card level is that it simplifies provisioning and minimizes operational issues for the carrier, which can now bond two or more copper pairs that are connected to the line card. Wintegra's latest software, which includes Ethernet bonding for multi-mode VDSL2, also offers TR-101 functionality in both the data and control paths. Ikanos' multi-mode VDSL2 chipsets and firmware support the transmission of EFM fragments to facilitate line card bonding.

Wintegra's Access Processors are the foundation for many industry leading DSLAM manufacturers because they offer a unique mix of high-performance and DSL-optimized silicon and a feature-rich suite of production-ready software. Wintegra's processors are fully software compatible across its DSL product line, providing scalable solutions that enable a wide range of products with minimal engineering resources.

The initial EFM bonding software release from Wintegra, which runs on its Access Processors, is available now and is fully interoperable with firmware on Ikanos' multi-mode VDSL2 CO chipsets.



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