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| The 1st Bondexpo, Trade Fair For Industrial Bonding Technology  The 1st BONDEXPO, trade fair for industrial bonding technology, will take place at the new Stuttgart Exhibition Centre from the 24th through the 27th of September, 2007. In launching this new, long awaited event, trade fair promoters P. E. Schall GmbH are consistently advancing their policy of innovation and expansion pursued in recent years. The fact that bonding, sealing and applying protective coatings with adhesives, sealants and filling compounds plays a primary role in many production and assembly processes justifies the creation of an discrete industry platform in theopinion of trade fair promoter Paul E. Schall. Whether manufacturers of adhesives, sealants or filling compounds are involved, or suppliers of dosing and application technology – BONDEXPO is the world's only information and communication platform in the field, and will bring all of the users and suppliers together at a single, central location. The event's nomenclature, which has been specifically adapted to the needs of the industry, will assure the necessary "cohesion", and includes the following main groups: raw materials for adhesives, sealants and filling compounds; machines, systems and accessories for the adhesives manufacturing industry; adhesives, sealants and filling compounds; machines, systems and accessories for the adhesives etc. processing industry; test and measuring technology; services. In particular during the age of lightweight manufacturing, conservation of resources and homogenous recycling, the bonding of similar as well as dissimilar materials by means of adhesives continues to gain importance. Especially in light of the fact that bonding through the use of adhesives is at least as old as joining and bonding technology itself. After all, gluing has long since established itself across the board as a discrete bonding process, and as a hybrid bonding process in combination with other mechanical joining and clinching methods. Furthermore, the importance of adhesives and gluing techniques has, to this very day, been greatly underestimated as an engineering concept for the broad field of bonding and other functions. There's no doubt that the time has come to take advantage of existing streamlining potential. write your comments about the article :: © 2007 Exhibition News :: home page |