TechConnect announced that it is accepting technology intellectual property (IP) and venture submissions for its upcoming TechConnect Summit 2007, to be held May 23-24 at the Santa Clara Convention Center. The TechConnect Summit is one of the largest and broadest showcases of the world's most promising technology IP and early stage ventures. The TechConnect Summit is an ideal forum for both technology presenters and "pre-seed" to "early-stage" companies, giving each group the opportunity to demonstrate their technologies and market advantages before the financial and technology business community.
All submissions will be pre-screened by the TechConnect Board, which includes more than 40 members representing leading universities, companies, and investment groups from around the world.
The 2007 TechConnect Summit will also feature exclusive Corporate Partnering Presentations from top companies representing diverse industry sectors, including ;BASF Hewlett-Packard; Genzyme Goodrich; Honda Medtronic; Merck Sanyo.
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