Toumaz Technology Delivers First Silicon from Infineon's RF Process

Toumaz Technology has delivered the first silicon from Infineon Technologies AG's advanced 130 nanometre RF CMOS process. Toumaz's integrated Sensium platform, a new ultra-low power wireless infrastructure system for health and lifestyle monitoring applications, taped-out on Infineon's specialised process in November 2006. The highly integrated Sensium chip met all the targeted accuracy and performance parameters in initial testing earlier this year.

The integrated Sensium platform incorporates an ultra-low power wireless transceiver including both RF and baseband functionality reconfigurable sensor interface, and digital block with a low power 8051 processor and memory on a single 4 x 4 mm chip. The new systems are now being made available to Toumaz's healthcare and pharmaceutical customers for trials.

The partnership agreement between Toumaz and Infineon included the licensing of digital blocks and IP cores for integration into the Sensium system. The Infineon and Toumaz teams worked very closely through each phase of the process, achieving tape-out less than 18 months after initial specification.

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