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| New Aremco-Bond 2315 high temp potting compound  Aremco-Bond 2315, a new high temperature, thermally conductive, epoxy-potting compound produced by Aremco Products, Inc., is now available for electrical and electronic potting applications to 365 °F. Additional features include high thermal conductivity, good electrical insulation, and low shrinkage after cure. Aremco-Bond 2315 provides high flexural strength of 12, 300 psi. Electrical properties include a volume resistivity of 1.0 x 1015, dielectric strength of 480 volts/mil, and dielectric constant of 4.7 at 1 kHz. Exceptional chemical resistance to acids, alkalis, organic fluids, and salts, is also provided.Aremco-Bond 2315 is a 100% solids epoxy that is mixed in a ratio of 100 parts resin to 25 parts hardener by weight. Mixed viscosity is 3, 000 cps and the pot life for a 100 gram mass is greater than 8 hours at room temperature. Recommended cure is 2 hours at 160 °F plus 2 hours at 300 °F. Alternative cure is 6 hours at 250 °F. Cured product is exhibits a linear shrinkage of .003 in/in and Shore-D hardness of 92. Aremco-Bond 2315 is useful for potting and encapsulating densely packaged power supplies, integrated circuits, thick film hybrid devices, digital-analog converters, oscillators, amplifiers, relays, transformers, and semiconductors. write your comments about the article :: © 2005 Construction News :: home page |